This work is supported by the National Key Research and Development Program of China (No. 2022YFE0138400) and Zhejiang Provincial Key R&D Program Project (No. 2023C01061).
Ye Tian, Student Member, IEEE, Bowen Liu, Student Member, IEEE, Chushan Li, Member, IEEE, Bowei Chen, Bin Guo, Yongjun Zheng, Haoze Luo, Senior Member, IEEE, Wuhua Li, Senior Member, IEEE, Xiangning He, Fellow, IEEE. An H∞ Observer-based 3-D Thermal Monitoring Method for Multi-chip IGBT Modules with Robustness to Model Parameter and Power Loss Uncertainty[J]. Protection and Control of Modern Power Systems,2025,V10(03):125-145.[Ye Tian, Student Member, IEEE, Bowen Liu, Student Member, IEEE, Chushan Li, Member, IEEE, Bowei Chen, Bin Guo, Yongjun Zheng, Haoze Luo, Senior Member, IEEE, Wuhua Li, Senior Member, IEEE, Xiangning He, Fellow, IEEE. An H∞ Observer-based 3-D Thermal Monitoring Method for Multi-chip IGBT Modules with Robustness to Model Parameter and Power Loss Uncertainty[J]. Power System Protection and Control,2025,V10(03):125-145]
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